This research focuses on heterogeneous integration techniques for advanced microscale inorganic electronics. We seek to produce novel device architectures by mechanically stacking optoelectronic devices from dissimilar growth templates for novel applications including, but not limited to, higher performance stacked III-V photovoltaic device architectures; alternative III-V substrates with reduced cost or enhanced properties; flexible and biocompatible optoelectronics for advanced wearable and implantable biological applications; multi-site and non-destructive brain-computer interface electronics targeting discrete read/write capabilities. We seek applicants with interest in microscale optoelectronic device fabrication, micro-transfer printing for stacked devices and optoelectronic assembly in flexible/biocompatible packaging, MBE As/P epitaxial growth, neuroengineering, and relevant materials/device characterization.

Additional Benefits

Awardees who reside more than 50 miles from their host laboratory and remain on tenure for at least six months are eligible for paid relocation to within the vicinity of their host laboratory.

A group health insurance program is available to awardees and their qualifying dependents in the United States.