RAP opportunity at Air Force Science and Technology Fellowship Program AF STFP
Flexible Hybrid Electronic Materials and Processing
Location
Materials & Manufacturing, RX/Soft Matter Materials
opportunity |
location |
|
13.25.04.B6127 |
Wright-Patterson AFB, OH 454337817 |
Advisers
name |
email |
phone |
|
Michael F. Durstock |
michael.durstock@us.af.mil |
808 449 4031 |
Description
An overarching theme for this research is the development of novel materials, structures, and device fabrication methodologies, and the characterization and understanding of these systems to promote the development flexible hybrid electronic systems. The development of enabling technologies for low-cost, lightweight, multifunctional materials, structures, sensors, and devices will be important for a multitude of next-generation applications including wearable electronics and the reduction of size, weight, and power for lightweight, conformal and integrated electronics. Specific areas of interest include, but are not limited to, flexible and printed electronics, stretchable electronic materials and devices, next-generation energy storage, harvesting & control technologies, mechanically robust electronic materials, and functional 3-D printing. Reserach focuses on the development of fundamental structure-property-function relationships required to enable the further development of future flexible, 3-D printed, integrated, and conformal electronic systems.
key words
Flexible electronics; Hybrid electronics; 3D printing; Additive manufacturing; Nanoparticles; Batteries; Nanomaterials; Devices; Self-assembly; Energy harvesting; Polymers; Nanostructures; Nanocomposites; Transistors; Conjugated polymers;
Eligibility
Citizenship:
Open to U.S. citizens
Level:
Open to Postdoctoral and Senior applicants
Stipend
Base Stipend |
Travel Allotment |
Supplementation |
|
$95,000.00 |
$5,000.00 |
|
Experience Supplement:
Postdoctoral and Senior Associates will receive an appropriately higher stipend based on the number of years of experience past their PhD.
|