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RAP opportunity at Air Force Science and Technology Fellowship Program     AF STFP

Flexible Hybrid Electronic Materials and Processing

Location

Materials & Manufacturing, RX/Soft Matter Materials

opportunity location
13.25.04.B6127 Wright-Patterson AFB, OH 454337817

Advisers

name email phone
Michael F. Durstock michael.durstock@us.af.mil 808 449 4031

Description

An overarching theme for this research is the development of novel materials, structures, and device fabrication methodologies, and the characterization and understanding of these systems to promote the development flexible hybrid electronic systems. The development of enabling technologies for low-cost, lightweight, multifunctional materials, structures, sensors, and devices will be important for a multitude of next-generation applications including wearable electronics and the reduction of size, weight, and power for lightweight, conformal and integrated electronics. Specific areas of interest include, but are not limited to, flexible and printed electronics, stretchable electronic materials and devices, next-generation energy storage, harvesting & control technologies, mechanically robust electronic materials, and functional 3-D printing. Reserach focuses on the development of fundamental structure-property-function relationships required to enable the further development of future flexible, 3-D printed, integrated, and conformal electronic systems.

 

key words
Flexible electronics; Hybrid electronics; 3D printing; Additive manufacturing; Nanoparticles; Batteries; Nanomaterials; Devices; Self-assembly; Energy harvesting; Polymers; Nanostructures; Nanocomposites; Transistors; Conjugated polymers;

Eligibility

Citizenship:  Open to U.S. citizens
Level:  Open to Postdoctoral and Senior applicants

Stipend

Base Stipend Travel Allotment Supplementation
$95,000.00 $5,000.00

Experience Supplement:
Postdoctoral and Senior Associates will receive an appropriately higher stipend based on the number of years of experience past their PhD.

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