The goal of this research project is to develop 3D heterogeneous integration (3DHI) packaging techniques using either traditional or non-traditional fabrication techniques (such as additive manufacturing techniques, polymer materials, etc.). We are expanding in-house 3DHI fabrication techniques, and the development of improved packaging techniques and methodologies for 3D heterogenous integration devices is critical before they can be integrated into functional devices and applications. The performance of these devices will be compared to that of current state-of-the-art devices. 

     This proposed project can explore the use of traditional fabrication techniques and the use of newer additive tools and processes, such as ink jet printing, aerosol jet printing, nanoimprint lithography, and nScrypt printing, can be used. Existing procedures for electronic device testing will be used to analyze and compare these devices to the current state of the art.  It is anticipated that a willingness to obtain multi-disciplinary academic excellence, drawing primarily from electrical engineering, materials science, physics, and chemistry, will be required  for research success.