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RAP opportunity at Air Force Science and Technology Fellowship Program     AF STFP

Nanoelectronic materials for low power electronics, heterogeneous integration, and sensing

Location

Materials & Manufacturing, RX/Soft Matter Materials

opportunity location
13.25.04.C0222 Wright-Patterson AFB, OH 454337817

Advisers

name email phone
Nicholas Robert Glavin nicholas.glavin.1@us.af.mil 937.255.6977

Description

Novel electronic materials are required for electronics that operate at a reduced power consumption, create efficient communications, and deliver function in extreme environments. Materials including 2D semiconductors, III-Nitrides, ferroelectric materials, polymer semiconductors, and mixed heterostructures enable design of new properties. Novel processes including heterogeneous integration, laser processing, and rapid device prototyping are of interest for next generation systems. Finally, relevant environment testing in low power operation and in other extreme environments will be key to understanding material limitations and potential improvements. 

Citations:

1) Dhiren K Pradhan, David C Moore, Gwangwoo Kim, Yunfei He, Pariasadat Musavigharavi, Kwan-Ho Kim, Nishant Sharma, Zirun Han, Xingyu Du, Venkata S Puli, Eric A Stach, W Joshua Kennedy, Nicholas R Glavin, Roy H Olsson III, Deep Jariwala, "A scalable ferroelectric non-volatile memory operating at 600C," Nature Electronics, 2024, 1-8.

2) Drake Austin, Brian Everhart, Farheen Khurshid, Jeyavelan Muthu, Anthony Pelton, Michael Altvater, Morgen Smith, Susanna Post, Paige Miesle, Christopher Muratore, Rahul Rao, Mario Hofmann, Placidus Amama, Nicholas Glavin, "Exploiting laser-induced oxidation phase diagrams for multifunctional titania thin films," Advanced Functional Materials, 2024, 34(13), 2310469.

3) Nicholas R Glavin, Rahul Rao, Vikas Varshney, Elisabeth Bianco, Amey Apte, Ajit Roy, Emilie Ringe, Pulickel M Ajayan, "Emerging Applicatios of Elementatl 2D Materials," Advanced Materials, 202032(7) 1904302. 

key words
Nanoelectronics; microelectronics; advanced computing; processing; fabrication; 2D materials; ferroelectrics;

Eligibility

Citizenship:  Open to U.S. citizens
Level:  Open to Postdoctoral and Senior applicants

Stipend

Base Stipend Travel Allotment Supplementation
$95,000.00 $5,000.00

Experience Supplement:
Postdoctoral and Senior Associates will receive an appropriately higher stipend based on the number of years of experience past their PhD.

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