We are seeking a Postdoctoral Researcher to advance the mechanical reliability of next-generation semiconductor architectures. This postdoctoral position focuses on developing high-fidelity Finite Element Method (FEM) simulations to characterize mechanical properties and deformation behavior in advanced packaging applications. It involves specifically modeling interfacial adhesion and fracture events generated by microscale indentation-based experimentation in hybrid bonding interfaces at elevated temperature.

We are looking for researchers with a PhD in Mechanical Engineering, Materials Science or Physics who has expertise in multi-physics simulations, non-linear FEM, inverse analysis and constitutive modeling. Prior experiences in modeling related to contact/fracture mechanics is preferred.

hybrid bonding; thermomechanical characterization; interfacial adhesion; fracture and contact mechanics; finite element modeling and simulation

citizenship

Open to U.S. citizens

level

Open to Postdoctoral applicants