We are seeking a Postdoctoral Researcher to advance the mechanical reliability of next-generation semiconductor architectures. This postdoctoral position focuses on developing measurement methodologies to characterize mechanical properties and deformation behavior in advanced packaging applications. It involves:

• Design, application, and evaluation of novel experimental setups and procedures for microscale mechanical testing at elevated temperatures
• Collection, analysis, and dissemination of experimental data to determine advanced mechanical properties (e.g., interfacial adhesion, fracture strength) of heterogeneous structures

We are looking for researchers with a PhD in Mechanical Engineering, Materials Science, or Physics who have expertise in microscale mechanical testing (e.g., instrumented indentation, scratch testing, fracture toughness testing).

Microscale Mechanical testing; indentation; scratch testing; fracture toughness; advanced packaging; Experimentation

citizenship

Open to U.S. citizens

level

Open to Postdoctoral applicants