Performance, security, and reliability of microelectronics systems are critical issues for the continued robust growth of the US economy. With new trends towards silicon disaggregation and heterogeneous integration it is becoming increasingly difficult to precisely verify circuit performance and validate model accuracy for these complex microelectronic systems, which often consist of multiple device layers stacked together to achieve higher levels of integration.

 

We are developing advanced electronic, thermal, and mechanical measurements to evaluate the performance, reliability, and security of advanced microelectronic structures. Experimental techniques include broadband, on-wafer microwave measurements up to 220 GHz, nonlinear measurements of mixing products and intermodulation, thermo-reflectance measurements for mapping chip temperature distributions, and near-field electromagnetic sensing techniques to probe electric and magnetic fields locally. These measurements are combined to help validate Multiphysics electro-thermo-mechanical models, assess performance, and improve security of the next generation of microelectronics and advanced packaging technologies.

Advanced Packaging; Microelectronics; Microwave; Multiphysics; mm-Wave; On-wafer Measurements;

citizenship

Open to U.S. citizens

level

Open to Postdoctoral applicants