Opportunity at National Institute of Standards and Technology NIST
Advanced Nanoscale Property Characterization by Atomic Force Microscopy
Material Measurement Laboratory, Materials Measurement Science Division
Please note: This Agency only participates in the February and August reviews.
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In the last few decades, the basic nanoscale three-dimensional (3D) surface profiling of the atomic force microscope (AFM) has been augmented by a variety of property characterizations that are extracted from the tip-sample interactions stimulated during scanning. Some of these AFM-based property characterization techniques are currently witnessing robust improvements in terms of their spatial resolution and quantitative measurement. They are posed now to advance from benchmark tests on well-defined geometries and materials to structures and integrated devices of interest for nanoscale applications (semiconductor industry, micro- and nano- electromechanical devices, etc.). Such advancement requires seamless integration of high-speed measurements onto basic AFM modes and realistic modeling of the AFM probe-sample interaction.
This research opportunity will focus on developing state of the art AFM instrumentation and computation modeling for 3D nanoscale property characterizations. In either mechanical, thermal, or electrical measurements, both in quasi-static and dynamic AFM modes, advanced modeling of the tip-sample contact and cantilever’s dynamics are sought to improve the accuracy and spatial resolution of the mapped properties. These developments will be incorporated in high-throughput property characterization AFM modes that are much in need for the nanoscale design and fabrication of the next generation of materials and structures. Examples of such applications include but are not limited to the heterogeneous integration of materials in the next generations of semiconductor devices.
atomic force microscopy; AFM instrumentation; nanoscale interactions; 3D nanoscale property characterization; tip-sample contact modeling; nanomechanics; thermal; electrostatic; electromechanics; high-throughput data acquisition; time and frequency domain measurements; semiconductor industry; micro- and nano- electromechanical devices;
Open to U.S. citizens
Open to Postdoctoral applicants